Module Packaging

Linxens Module has many facets that can be tailored to different applications. Modules are delivered on a 35-mm-tape to enable manufacturing of smartcard for SIM, contact banking, contactless banking, transport or access cards. Thanks to Linxens’ various semiconductors packaging solutions and tape innovations, companies can optimize their Total Cost of Ownership and benefit high productivity and quality standards.

Module packaging : Our expertise centers

Shanghai - China

Active since : 2019
Certifications:
ISO 9001:2015- Card quality Management - EAL6
Products: Modules
Capacity: 100 Millions per month

Ayutthaya 2 - Thailand

Active since : 2001
Certifications:
EAL6 - Card Quality Management - Sony Green Partner - ISO 9001:2015 - ISO 14001:2015 - ISO 45001:2018
Products:
Modules - HeavyLam - BioLam
Capacity: 30 Millions units per month

Mantes-la-Jolie - France

Active since: 1989
People working: 280
Certifications:
ISO 9001:2015 - ISO 14001:2015 - ISO 45001:2018 - ISO 13483:2016 - Card quality Management - EAL6
Products: Tapes, Inlays, Module Packaging
Capacity: 1,4 Billion pieces

Changi - Singapore

Active since : 2003
Certifications:
ISO 9001:2015 - ISO 14001:2015 - ISO 45001: 2018 - ISO 50001 : 2018 - Card quality Management - EAL6
Products:
Tapes : Flexible Etched Circuit - Modules : Semiconductor Packaging
Capacity: 800 Millions pieces M3 Eq

Ayutthaya 1 - Thailand

Active since : 2001
Certifications:
EAL6 - Card Quality Management - Sony Green Partner - ISO 9001:2015 - ISO 14001:2015 - ISO 45001:2018
Products:
e-Passports, national ID and Health cards, eVisa documents and driving license
Capacity: 16 Millions units per month

Ayutthaya 3 - Thailand

Active since: 2001
Certifications:
EAL6 - Card Quality Management - Sony Green Partner - ISO 9001:2015 - ISO 14001:2015 - ISO 45001:2018
Products:
Dual Interface manufacturing: zigzag pads, wire pads and Inductive coupling inlay
Capacity: 45 Millions units per month

Our expertise in context : applications

Payment

We are committed to continuously improving the customer’s payment experience by designing innovative features that make customers feel valued, convenient and responsible.

Telecom

We’re continuously meeting the need for new telecommunication services & applications around the world by providing customised connectivity solutions with the highest level of quality, reliability and environmental resistance

Smart Access

We provide people with secure access to places, tools or resources by designing smart & modular solutions for seamless access control that meet public & private needs.

Mobility

We give urban dwellers easy access to sustainable mobility services by designing reliable & low impact solutions for seamless access to shared transportation. By designing reliable & low impact solutions for seamless access to shared transportation.

Product Spotlight

Coil on Module

Linxens Coil on Module (CoM) inlay uses an RFID link in place of the mechanical connection typically used between the card antenna and the module. It mproves the robustness and long-term reliability of dual interface ID documents, but it also simplifies the card design and manufacturing.

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Module Packaging

Streamlining Smartcard Production