Module Packaging

Streamlining Smartcard Production

Customizable solutions for smartcards production, enhancing efficiency and quality in the payment, telecom, mobility and smart access sectors.

Linxens Module has many facets that can be tailored to different applications. Modules are delivered on a 35-mm-tape to enable manufacturing of smartcard for SIM, contact banking, contactless banking, transport or access cards. Thanks to Linxens’ various semiconductors packaging solutions and tape innovations, companies can optimize their Total Cost of Ownership and benefit high productivity and quality standards.

Module packaging : Our expertise centers

Shanghai - China

Mantes-la-Jolie - France

Changi - Singapore

Tianjin - China

Ayutthaya - Thailand

  • Active since: 2001
  • Number of employees: 1400
  • Certifications:
    EAL6 - Card Quality Management  - Sony Green Partner - ISO 9001:2015 - ISO 14001:2015 - ISO 45001:2018
  • Products: Modules - Prelam - e-Passport - National ID - Health Cards -eVisa documents - driving license
    Dual Interface manufacturing: zigzag pads, wire pads and Inductive coupling inlay
  • Capacity per year: 192 Million units of e-Passport - 360 Million units of Modules - 540 Million units of Inlays

Product Spotlight

Contactless module

The Linxens Contactless Module is suitable for connection to an antenna inlay when integrated into a contactless card that needs the highest reliability. The module is compliant with ISO standards and includes a contactless chip

Contact & Dual module packaging

Linxens Module has many facets that can be tailored to different applications. Modules are delivered on a reel that serve either as a SIM, contact payment, contactless payment or transport card. 

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