Telecom

UltraSIM

The Ultrathin Gold solution for low-end SIM cards

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Description

The Gold nano-protection layer of Linxens UltraSIM delivers the thinnest gold configuration available in 2FF / 3FF. UltraSIM offers cost-efficient solution without compromising at all product performance, while maintaining the scratch and corrosion resistance.

 

Key Features

  • Nanoprotection of Gold on contact surface preventing nickel oxidation and allergies
  • Visual appearance on contact surface remains yellowish
  • Basic corrosion resistance

Options

  • Micro-etched / Fully-etched logo
  • 2FF / 3FF / 4FF

Compliance Labels

  • ISO 10373-3
  • ISO 7816-1
     

References

Part Number
Module
Model
Cavity
Chip Dimension
2FF/3FF
9X12415
6
UltraSIM
Failed
3.2 X 3
2FF/3FF
9X12416
6
UltraSIM
Passed
1.8 X 1.8
2FF/3FF
9X12501
6
UltraSIM
Failed
2.6 X 2.6
2FF/3FF
9X13901
6
UltraSIM
Passed
1.8 X 1.8
2FF/3FF
9X13902
6
UltraSIM
Failed
3.2 X 3
2FF/3FF
9X13704
6
UltraSIM
Passed
1.8 X 1.8
2FF/3FF
9X13705
6
UltraSIM
Failed
3 X 3
2FF/3FF
9X21002
6
UltraSIM
Passed
3.9 X 4.9
2FF/3FF
9X21003
6
UltraSIM
Failed
4.1 X ≤ 6
4FF
9X13101
6
UltraSIM
Passed
2.5 X 2.5
4FF
9X12420
6
UltraSIM
Passed
1.8 x 1.8
4FF
9X21005
6
UltraSIM
Passed
3.9 X 4.9
4FF
9X25301
6
UltraSIM
Passed
3.1 X 3.6