Financial services

Palladium Gen3

The banking industry reference for Palladium plating configuration

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Description

Linxens Palladium Gen3 is the industry reference for Palladium plating with Gold flash configuration beneath the Palladium layer for improved product cost-efficiency. Linxens Palladium Gen3 maintains the highest yield for wire bonding and optimal corrosion performance.
 

Key Features

  • High corrosion resistance
  • Easy integration of the module
  • Featured for payment cards
  • Contact solution
  • Palladium layer

Options

  • Micro-etched / Fully-etched logos
  • Colored Tape: Red, blue, orange

Compliance Labels

  • ISO 10373
  • ISO 7810

References

Part Number
Module
Model
Cavity
Chip Dimension
9X12121
8
Palladium Gen3
Failed
3.6 X 3.65
9X16001
8
Palladium Gen3
Passed
3.6 X 3.6
9X16004
8
Palladium Gen3
Failed
4.8 X 4.8
9X23206
8
Palladium Gen3
Passed
3.8 X 6.6
9X23207
8
Palladium Gen3
Failed
5.6 X ≤ 8
9X13902
6
Palladium Gen3
Failed
3.2 X 3
9X13705
6
Palladium Gen3
Failed
3 X 3